Printed Circuit Board Assembly (SMT)

Partial Equipment Listing

DEK 265GS

• Full Version Solder Paste Stencil Printer
• 20" x 20" Print Area, 0.002-0.25" Board Thicknes
• Autopaste Dispenser
• Underscreen Cleaner
• Autoflex Tooling

MYDATA TP9-2U

• SMD Placement Machine w/Fine Pitch Vision System
• Below 15 Mill Placement Capability
• Placement From 0402 to 2" x 2" BGA Components
• 17"X 13" Board Handling Tray

CAMELOT

• Solder Paste
• Solder Mask
• Glue Dispensing

VITRONICS 500S

• IsoTherm Forced Convection Reflow/Curing Systems
• Edge Conveyor for Double-Sided Boards
• 5 Heat Zones
• Computerized Profiling

 

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